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10THB330M - Panasonic

Description: Panasonic 330μF Solid Polymer Tantalum Capacitor, 10 V dc ±20%, TH Series

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Symbol
10THB330M - Panasonic - PCB symbol
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PCB Footprints
10THB330M - Panasonic PCB footprint - Other - Other - D4
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3D Models
10THB330M - Panasonic - 3D model - Other - D4
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10THB330M Details

  • Manufacturer Part Number:

    10THB330M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Indonesia, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    0

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ, RIPPLE CURRENT IS MEASURED AT 100KHZ AND 45CEL

  • Capacitance:

    330 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (SOLID POLYMER)

  • ESR:

    35 mΩ

  • Height:

    3.8 mm

  • JESD-609 Code:

    e4

  • Leakage Current:

    0.33 mA

  • Length:

    7.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 7/13 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    10 V

  • Ripple Current:

    3000 mA

  • Size Code:

    2917

  • Surface Mount:

    YES

  • Tan Delta:

    0.1

  • Terminal Finish:

    Palladium/Gold (Pd/Au)

  • Terminal Shape:

    J BEND

  • Width:

    4.3 mm

10THB330M Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 10THB330M is a rectangular pad with dimensions of 5.5mm x 3.5mm, with a thermal pad in the center. The pad should have a solder mask defined (SMD) and a solder paste layer.
  • To ensure reliable soldering of the 10THB330M, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the 10THB330M is -40°C to 150°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range.
  • Yes, the 10THB330M is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the vibrations.
  • Handle the 10THB330M with care to prevent damage. Store the components in their original packaging or in a dry, cool place. Avoid exposing the components to moisture, extreme temperatures, or physical stress during shipping and storage.

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10THB330M Overview

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Part Image T525Y337M010AME0357280 KEMET Corporation

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Part Image T525Y337M010AGE0357280 KEMET Corporation

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Part Image T525Y337M010AHE035 KEMET Corporation

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Part Image 10THB330M SANYO Electric Co Ltd

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For a full list of alternate parts for 10THB330M, check out Findchips.com