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172299-2204 - Molex

Description: Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 4 Circuits, with Solder Clips, Glow-Wire Capable

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PCB Footprints
172299-2204 - Molex PCB footprint - Other - Other - 172299-YY04
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3D Models
172299-2204 - Molex  - 3D model - Other - 172299-YY04
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172299-2204 Details

  • Manufacturer Part Number:

    172299-2204

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    30 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    8

  • Additional Feature:

    RATED CURRENT(POWER): 11A

  • Body Breadth:

    0.524 inch

  • Body Depth:

    0.551 inch

  • Body Length:

    0.417 inch

  • Connector Type:

    RECTANGULAR POWER CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Tin (Sn)

  • Contact Gender:

    MALE

  • Contact Material:

    COPPER ALLOY

  • Contact Style:

    SQ PIN-SKT

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • Insulator Material:

    LIQUID CRYSTAL POLYMER

  • JESD-609 Code:

    e3

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Type:

    BOARD

  • Operating Temperature-Max:

    120 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • Reference Standard:

    CSA; UL

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    4

  • UL Flammability Code:

    94V-0

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored

172299-2204 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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