The recommended land pattern for the 1812FS-122JLC is a rectangular pad with a size of 1.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. This can be found in Coilcraft's Land Pattern Recommendations document.
To minimize the impact of PCB layout and proximity to other components, keep the 1812FS-122JLC at least 1.5 mm away from other components, and avoid running high-frequency signals or power traces underneath the inductor. Also, use a solid ground plane underneath the inductor to reduce electromagnetic interference (EMI).
The 1812FS-122JLC has an operating temperature range of -40°C to +125°C, with a maximum storage temperature of +150°C. However, the inductor's performance may degrade at extreme temperatures, so it's essential to consider the application's temperature requirements.
To ensure EMC compliance, follow proper PCB layout and shielding techniques, such as using a metal shield can or a mu-metal shield around the inductor. Additionally, consider using a common-mode choke or a ferrite bead in conjunction with the 1812FS-122JLC to reduce EMI.
The 1812FS-122JLC has an MSL rating of 1, which means it can withstand exposure to moisture without damage. However, it's still essential to follow proper handling and storage procedures to prevent moisture absorption.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
1812FS-122JLC Overview
Use the download button to access the 1812FS-122JLC schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 1812F,
or try a keyword search, such as Fixed Inductors
About COILCRAFT
Colicraft designs and manufactures high performing magnectic components, RF chip inductors, power magnectics, and filters. Coilcraft has engineering, manufacturing, and distribution facilities in North America, Asia, and Europe.
