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1EBN1001AE - Infineon

Description: Gate Drivers DRIVER_IC

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1EBN1001AE Details

  • Manufacturer Part Number:

    1EBN1001AE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    15 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max:

    3.1 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    13 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    -10 V

  • Supply Voltage1-Min:

    -5 V

  • Supply Voltage1-Nom:

    -8 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.01 µs

  • Width:

    3.9 mm

1EBN1001AE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the power source, and the input and output capacitors should be placed close to the device.
  • The device should be mounted on a heat sink with a thermal resistance of less than 10°C/W. The heat sink should be connected to a solid ground plane to ensure good thermal conductivity.
  • The maximum allowed voltage drop across the device is 1.5V. Exceeding this voltage drop may cause the device to overheat or malfunction.
  • The device is rated for operation up to 150°C. However, the maximum operating temperature may be limited by the specific application and the thermal design of the system.
  • Overvoltage protection can be achieved using a voltage clamp or a zener diode. Overcurrent protection can be achieved using a current sense resistor and a comparator or a dedicated overcurrent protection IC.

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