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1ED020I12-FT - Infineon

Description: Gate Drivers ISOLATED DRIVER

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PCB Footprints
1ED020I12-FT - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - DSO-16
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1ED020I12-FT - Infineon  - 3D model - Small Outline Packages - DSO-16
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1ED020I12-FT Details

  • Manufacturer Part Number:

    1ED020I12-FT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    HALF BRIDGE BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.34 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    2.64 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    2 µs

  • Turn-on Time:

    2 µs

  • Width:

    7.52 mm

1ED020I12-FT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid copper plane on the bottom layer, connected to the thermal pad of the device. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, ensure good airflow, and consider using a heat sink if necessary.
  • The 1ED020I12-FT has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions when handling the device to prevent damage.
  • Yes, the 1ED020I12-FT is suitable for high-reliability and safety-critical applications, but it's essential to follow the recommended design guidelines and testing procedures to ensure the device meets the required safety and reliability standards.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes, then use standard debugging techniques such as signal tracing and logic analysis to identify the root cause of the issue.

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1ED020I12-FT Overview

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