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1ED3491MC12MXUMA1 - Infineon

Description: Gate Drivers ISOLATED DRIVER

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1ED3491MC12MXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-16_2022
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3D Models
1ED3491MC12MXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-16_2022
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1ED3491MC12MXUMA1 Details

  • Manufacturer Part Number:

    1ED3491MC12MXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    11 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    25 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.262 µs

  • Turn-on Time:

    0.27 µs

  • Width:

    6.4 mm

1ED3491MC12MXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design and layout guidelines in their application notes and evaluation boards. It's essential to follow these guidelines to ensure proper heat dissipation, signal integrity, and EMI reduction.
  • Infineon provides EMC guidelines and recommendations in their application notes. Additionally, following proper PCB layout practices, using shielding, and implementing filtering and shielding techniques can help minimize EMI.
  • Monitor parameters such as voltage, current, temperature, and fault flags. Implement overvoltage, undervoltage, and overcurrent protection mechanisms, as well as thermal monitoring and shutdown. Infineon provides guidelines on fault detection and protection in their application notes.
  • Consult Infineon's application notes and evaluation boards for optimization guidelines. Additionally, consider factors such as input voltage, output voltage, switching frequency, and load characteristics to optimize performance and efficiency.
  • Infineon provides reliability data and guidelines in their datasheet and application notes. Ensure proper thermal management, operate within specified voltage and current ranges, and follow recommended storage and handling procedures to maximize lifespan.

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1ED3491MC12MXUMA1 Overview

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