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1EDC60H12AHXUMA1 - Infineon

Description: IC IGBT GATE DRIVER UL 8DSOP

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1EDC60H12AHXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-59
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1EDC60H12AHXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-59
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1EDC60H12AHXUMA1 Details

  • Manufacturer Part Number:

    1EDC60H12AHXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany, Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Built-in Protections:

    OVER CURRENT; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    35 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.33 µs

  • Width:

    6.3 mm

1EDC60H12AHXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
  • The 1EDC60H12AHXUMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • Yes, the 1EDC60H12AHXUMA1 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • Start by reviewing the datasheet and application notes, then check the PCB design and assembly for any errors or defects. Use oscilloscopes or logic analyzers to debug the issue, and consider contacting Infineon's technical support for further assistance.

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1EDC60H12AHXUMA1 Overview

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