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1EDI10I12MFXUMA1 - Infineon

Description: Gate Drivers 1200V Isolated 1-CH, 2.3A,Miller clamp

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1EDI10I12MFXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-51
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1EDI10I12MFXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-51
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1EDI10I12MFXUMA1 Details

  • Manufacturer Part Number:

    1EDI10I12MFXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    2.2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2.2 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.33 µs

  • Width:

    3.9 mm

1EDI10I12MFXUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple or thermistor to monitor the device temperature.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering, as it may damage the device.
  • Use ESD-protective packaging, wrist straps, and mats during handling and assembly. Ensure that the device is stored in a conductive bag or container when not in use.
  • Use a pi-filter or a common-mode choke at the input and output stages to reduce electromagnetic interference (EMI) and ensure compliance with regulatory standards.

Trust Checks

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Manufacturer Collaborated
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1EDI10I12MFXUMA1 Overview

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