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1EDI2010ASXUMA1 - Infineon

Description: Gate Drivers ISOLATED HVIC

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PCB Footprints
1EDI2010ASXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - DSO-36
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1EDI2010ASXUMA1 - Infineon  - 3D model - Small Outline Packages - DSO-36
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1EDI2010ASXUMA1 Details

  • Manufacturer Part Number:

    1EDI2010ASXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SSOP-36

  • Country Of Origin:

    Austria, Germany, Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Built-in Protections:

    OVER CURRENT; THERMAL

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP36,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.65 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.255 µs

  • Turn-on Time:

    0.255 µs

  • Width:

    7.6 mm

1EDI2010ASXUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead to filter out electromagnetic interference (EMI).
  • The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause permanent damage to the device.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.

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1EDI2010ASXUMA1 Overview

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