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1EDI40I12AFXUMA1 - Infineon

Description: Driver 7.5A 1-OUT High Side Inv/Non-Inv 8-Pin DSO T/R

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1EDI40I12AFXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO 8+
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1EDI40I12AFXUMA1 Details

  • Manufacturer Part Number:

    1EDI40I12AFXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    7.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    35 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.33 µs

  • Width:

    3.9 mm

1EDI40I12AFXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2014-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon recommends following the guidelines in their application note AN2013-03, which provides guidance on PCB design, component selection, and shielding to ensure EMC compliance.
  • According to Infineon's application note AN2015-02, the maximum allowed voltage stress on the device pins is 1.5 times the maximum rated voltage, but not exceeding 40V.
  • Infineon recommends following the guidelines in their application note AN2012-01, which provides guidance on soldering and rework techniques to prevent damage to the device.
  • Infineon recommends storing the device in a dry, cool place, away from direct sunlight and moisture, and handling the device with anti-static precautions to prevent damage.

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1EDI40I12AFXUMA1 Overview

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