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1EDI40I12AHXUMA1 - Infineon

Description: Infineon 1EDI40I12AHXUMA1 Dual Galvanic Isolated MOSFET Power Driver, -6.8 A, 7.5 A 8-Pin, DSO

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1EDI40I12AHXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-59
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1EDI40I12AHXUMA1 Details

  • Manufacturer Part Number:

    1EDI40I12AHXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany, Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Built-in Protections:

    OVER CURRENT; UNDER VOLTAGE

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    7.5 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    35 V

  • Supply Voltage1-Min:

    13 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.33 µs

  • Width:

    6.3 mm

1EDI40I12AHXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2014-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the IGBT's gate-emitter voltage. The driver should also have a suitable propagation delay and rise/fall time to ensure proper switching.
  • The maximum allowed overcurrent is typically specified in the datasheet as a percentage of the nominal current rating. To protect the module, use a fast-acting fuse or a current sensing circuit with a shutdown mechanism to prevent damage from overcurrent conditions.
  • Ensure good thermal contact between the module and the heat sink, and use a heat sink with a sufficient thermal conductivity. Also, consider using a thermal interface material and ensure proper airflow around the heat sink to prevent hot spots.
  • Infineon provides guidelines for soldering and assembly in their application note AN2014-04, which includes recommendations for soldering temperature, time, and flux type, as well as handling and storage procedures to prevent damage.

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