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1EDN7550BXTSA1 - Infineon

Description: INFINEON - 1EDN7550BXTSA1 - MOSFET Driver, High Side, 4.5V to 20V Supply, 8A Out, 45ns Delay, SOT-23-6

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PCB Footprints
1EDN7550BXTSA1 - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23-6
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1EDN7550BXTSA1 - Infineon  - 3D model - SOT23 (6-Pin) - SOT23-6
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1EDN7550BXTSA1 Details

  • Manufacturer Part Number:

    1EDN7550BXTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 6 PIN

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2018-05-22

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    8 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.055 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    1.6 mm

1EDN7550BXTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Infineon recommends following the guidelines in their application note AN2013-02, which provides guidance on PCB layout, component selection, and shielding to ensure EMC compliance.
  • According to Infineon's application note AN2013-03, the maximum allowed voltage stress on the device pins is 10% above the recommended operating voltage, but not exceeding the absolute maximum ratings specified in the datasheet.
  • Infineon recommends following the guidelines in their application note AN2013-04, which provides guidance on soldering and rework techniques to prevent damage to the device.
  • Infineon recommends storing the device in a dry, cool place, away from direct sunlight and moisture, and handling the device with anti-static precautions to prevent damage.

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1EDN7550BXTSA1 Overview

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Part Image 1EDN7550B Infineon Technologies AG

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