1N5618US footprint, schematic symbol and 3D model by Microsemi Corporation

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PCB Footprints

1N5618US - Microsemi Corporation PCB footprint - Other - Other - JAN1N5614US-1

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Part Number 1N5618US
Manufacturer Microsemi Corporation
Pin Count 2
Part Category Diode
Package Category Other
Footprint Name Other - JAN1N5614US-1
Released Date Feb 10, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

1N5618US Details

Manufacturer Part Number:
1N5618US
Pbfree Code:
No
Part Life Cycle Code:
Transferred
Package Description:
HERMETIC SEALED, GLASS, D-5A, 2 PIN
Pin Count:
2
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
Microsemi Corporation (now Microchip)
Additional Feature:
HIGH RELIABILITY
Case Connection:
ISOLATED
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.3 V
JESD-30 Code:
O-LELF-R2
JESD-609 Code:
e0
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
200 °C
Operating Temperature-Min:
-65 °C
Output Current-Max:
1 A
Package Body Material:
GLASS
Package Shape:
ROUND
Package Style:
LONG FORM
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
600 V
Reverse Recovery Time-Max:
2 µs
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
TIN LEAD
Terminal Form:
WRAP AROUND
Terminal Position:
END

1N5618US Frequently Asked Questions (FAQs)

The recommended operating temperature range for the 1N5618US is -65°C to 150°C, although it can withstand storage temperatures from -65°C to 200°C.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a soldering flux that is compatible with the device's lead finish. Avoid applying excessive heat or force, which can damage the device.
The maximum surge current rating for the 1N5618US is 30A for a 10/1000μs waveform, as per the JEDEC JESD201A standard.
Yes, the 1N5618US is designed for high-reliability applications and is qualified to various military and aerospace standards, including MIL-PRF-19500 and NASA GSFC-S-311-P-1.
To prevent electrostatic discharge (ESD) damage, handle the 1N5618US with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the device's leads or body, and ensure that the device is properly grounded during handling and assembly.

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1N5618US Overview

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