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1N5823 - Microsemi Corporation

Description: Diode Schottky 20V 5A 2-Pin TOP HAT Tray

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PCB Footprints
1N5823 - Microsemi Corporation PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - 1N5825
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3D Models
1N5823 - Microsemi Corporation  - 3D model - Diodes, Axial Diameter Horizontal Mounting - 1N5825
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1N5823 Details

  • Manufacturer Part Number:

    1N5823

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.47 V

  • JESD-30 Code:

    O-XALF-W2

  • JESD-609 Code:

    e0

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

1N5823 Frequently Asked Questions (FAQs)

  • The 1N5823 can operate safely between -65°C to 175°C, but the maximum junction temperature should not exceed 150°C for reliable operation.
  • Use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder to the anode lead. Ensure the solder flows smoothly and does not form a 'cold joint'.
  • Store the 1N5823 in a dry, cool place with a relative humidity of 60% or less. Avoid exposing the device to temperatures above 30°C or humidity above 80%.
  • Yes, the 1N5823 is suitable for switching power supply applications due to its fast switching speed and low forward voltage drop. However, ensure the device is properly heat-sinked and the maximum current rating is not exceeded.
  • Calculate the power dissipation (Pd) using the formula: Pd = (Vf x If) + (Vr x Ir), where Vf is the forward voltage, If is the forward current, Vr is the reverse voltage, and Ir is the reverse current. Ensure the calculated Pd does not exceed the maximum power rating of 50W.

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1N5823 Overview

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Part Image 1N5823E3 Microsemi Corporation (now Microchip)

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Part Image 1N5823 International Semiconductor Inc

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