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1PS76SB40 - NXP

Description: schottky Diodes & Rectifiers 1PS76SB40/SOD323/SOD2

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PCB Footprints
1PS76SB40 - NXP PCB footprint - Small Outline Diode - Small Outline Diode - SOD323 (SC-76)
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3D Models
1PS76SB40 - NXP  - 3D model - Small Outline Diode - SOD323 (SC-76)
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1PS76SB40 Details

  • Manufacturer Part Number:

    1PS76SB40

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SC-76

  • Package Description:

    SC-76, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1PS76SB40 Frequently Asked Questions (FAQs)

  • NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials, such as thermal grease or thermal tape, to improve heat transfer between the device and the heat sink.
  • The 1PS76SB40 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. NXP recommends using an ESD wrist strap or mat, and ensuring that the device is handled in a static-safe environment.
  • Yes, the 1PS76SB40 is suitable for high-reliability and automotive applications. NXP provides a range of documentation and support for these applications, including AEC-Q100 qualification, PPAP (Production Part Approval Process) support, and dedicated automotive-grade products.
  • To troubleshoot issues with the 1PS76SB40, start by reviewing the device's operating conditions, including voltage, current, and temperature. Check for any signs of physical damage, such as cracks or corrosion, and verify that the device is properly soldered to the PCB. NXP also provides a range of support resources, including application notes, FAQs, and technical support teams.

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1PS76SB40 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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