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1SMA5937BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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1SMA5937BT3G - onsemi - PCB symbol
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1SMA5937BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - 1SMA5937BT3G
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1SMA5937BT3G - onsemi - 3D model - Diodes Moulded - 1SMA5937BT3G
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1SMA5937BT3G Details

  • Manufacturer Part Number:

    1SMA5937BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    33 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    800 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    25.1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    11.4 mA

1SMA5937BT3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended voltage and current ratings. Also, consider the derating curves provided in the datasheet to ensure the device is not overstressed. Proper thermal management and a clean, dry environment are also crucial for reliable operation.
  • The 1SMA5937BT3G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is not exposed to static electricity during handling.
  • The 1SMA5937BT3G is a commercial-grade device, but onsemi offers a range of high-reliability and aerospace-grade devices. For high-reliability applications, consider using a device with a higher qualification level, such as the 1SMA5937BT3G-TR or a radiation-hardened device.
  • Use a soldering iron with a temperature of 260°C (500°F) or less. Avoid applying excessive heat or force, which can damage the device. For rework, use a low-temperature soldering iron and a solder wick or desoldering braid to remove excess solder.

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1SMA5937BT3G Overview

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