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1SMA5940BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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PCB Footprints
1SMA5940BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02
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3D Models
1SMA5940BT3G - onsemi  - 3D model - Diodes Moulded - SMA CASE 403D-02
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1SMA5940BT3G Details

  • Manufacturer Part Number:

    1SMA5940BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    53 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    950 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    43 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    32.7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    8.7 mA

1SMA5940BT3G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 1SMA5940BT3G is -55°C to 150°C.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C. Also, ensure the PCB is designed with a suitable thermal relief pattern to prevent thermal stress on the component.
  • The maximum allowable power dissipation for the 1SMA5940BT3G is 1500 W. However, this value may vary depending on the specific application and operating conditions.
  • Handle the 1SMA5940BT3G with care to prevent mechanical stress and electrostatic discharge (ESD). Store the components in their original packaging or in a shielded bag to prevent ESD damage.
  • Ensure the PCB layout provides adequate thermal relief, uses a suitable land pattern, and minimizes parasitic inductance and capacitance. Also, consider the component's thermal pad and pinout when designing the PCB layout.

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1SMA5940BT3G Overview

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For a full list of alternate parts for 1SMA5940BT3G, check out Findchips.com