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1SMB10CAT3G - onsemi

Description: 600 Watt Peak Power Zener Transient Voltage Suppressors

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PCB Footprints
1SMB10CAT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403C-01
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3D Models
1SMB10CAT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403C-01
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1SMB10CAT3G Details

  • Manufacturer Part Number:

    1SMB10CAT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403C-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, LOW IMPEDANCE

  • Breakdown Voltage-Max:

    12.3 V

  • Breakdown Voltage-Min:

    11.1 V

  • Clamping Voltage-Max:

    17 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    10 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1SMB10CAT3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 1SMB10CAT3G is -55°C to 150°C.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point below 260°C. Also, ensure the PCB is designed with a suitable thermal relief pattern.
  • The recommended land pattern for the 1SMB10CAT3G is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a 0.5 mm diameter thermal via connected to a larger thermal pad on the bottom layer.
  • Yes, the 1SMB10CAT3G is suitable for high-reliability applications due to its robust design and manufacturing process, which includes 100% screening and burn-in testing.
  • Store the 1SMB10CAT3G in its original packaging or in a moisture-proof bag, and avoid exposing it to direct sunlight, moisture, or extreme temperatures during shipping.

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1SMB10CAT3G Overview

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