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1SMB14AT3G - onsemi

Description: ON Semiconductor 1SMB14AT3G Uni-Directional TVS Diode, 600W peak, 2-Pin SMB

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1SMB14AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE H
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1SMB14AT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE H
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1SMB14AT3G Details

  • Manufacturer Part Number:

    1SMB14AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-214

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, LOW IMPEDANCE

  • Breakdown Voltage-Max:

    17.2 V

  • Breakdown Voltage-Min:

    15.6 V

  • Clamping Voltage-Max:

    23.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    14 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1SMB14AT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the 1SMB14AT3G involves placing the device close to the power source, using a ground plane, and minimizing lead lengths. A recommended layout is to place the device near the power source, with the anode connected to the power source and the cathode connected to the load. The ground plane should be as large as possible to reduce inductance and improve heat dissipation.
  • The voltage rating of the 1SMB14AT3G should be selected based on the maximum voltage of the power source. The device is available in various voltage ratings, including 10V, 14V, and 16V. Choose a voltage rating that is at least 10-20% higher than the maximum voltage of the power source to ensure reliable operation.
  • The maximum junction temperature of the 1SMB14AT3G is 150°C. Operating the device above this temperature can reduce its reliability and lifespan.
  • The 1SMB14AT3G is a sensitive device and requires proper ESD protection during handling and assembly. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's leads or pins, and use anti-static packaging and storage materials.
  • Yes, the 1SMB14AT3G is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is essential to follow proper design, assembly, and testing procedures to ensure the device operates reliably in the application.

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1SMB14AT3G Overview

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