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1SMB5916BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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PCB Footprints
1SMB5916BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03
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3D Models
1SMB5916BT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03
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1SMB5916BT3G Details

  • Manufacturer Part Number:

    1SMB5916BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    6 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    4.3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    87.2 mA

1SMB5916BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 1SMB5916BT3G is a standard SOD-123 package with a pad size of 0.8 mm x 0.8 mm and a spacing of 0.5 mm between pads.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (-55°C to 150°C), and consider using a heat sink or thermal pad to dissipate heat.
  • The maximum surge current rating for the 1SMB5916BT3G is 58 A for a 10/1000 μs waveform, as specified in the datasheet.
  • Yes, you can use multiple 1SMB5916BT3G devices in parallel to increase the power rating, but ensure that each device is properly matched and that the total current rating is not exceeded.
  • To prevent ESD damage, handle the 1SMB5916BT3G with an anti-static wrist strap or mat, and ensure that all equipment and tools are properly grounded.

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1SMB5916BT3G Overview

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