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1SMB5925B-13 - Diodes Incorporated

Description: ESD Suppressors / TVS Diodes 3.0W SM POWER ZENER 6.2V 39V 200mA 1.2

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1SMB5925B-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
1SMB5925B-13 - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - B130LB-13-F
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1SMB5925B-13 - Diodes Incorporated - 3D model - Diodes Moulded - B130LB-13-F
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1SMB5925B-13 Details

  • Manufacturer Part Number:

    1SMB5925B-13

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    4.5 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Voltage-Nom:

    10 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    37.5 mA

1SMB5925B-13 Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 1SMB5925B-13 can be found in the Diodes Incorporated's application note AN-114, which provides guidelines for PCB layout and assembly.
  • To ensure proper soldering and assembly, follow the recommended soldering profile and handling procedures outlined in the Diodes Incorporated's application note AN-115, which provides guidelines for surface mount assembly.
  • The 1SMB5925B-13 has a thermal resistance of 25°C/W. To ensure proper thermal management, a thermal pad or heat sink may be required, especially in high-power applications. Consult the datasheet and application notes for more information.
  • The 1SMB5925B-13 is an AEC-Q101 qualified device, making it suitable for automotive applications. However, it's essential to consult the datasheet and application notes to ensure the device meets the specific requirements of your automotive application.
  • The 1SMB5925B-13 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). To ensure proper ESD protection, follow the recommended handling and assembly procedures outlined in the Diodes Incorporated's application notes.

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1SMB5925B-13 Overview

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