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1SMB5932BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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Symbol
1SMB5932BT3G - onsemi - PCB symbol
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PCB Footprints
1SMB5932BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03
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3D Models
1SMB5932BT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03
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1SMB5932BT3G Details

  • Manufacturer Part Number:

    1SMB5932BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    14 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    20 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    18.7 mA

1SMB5932BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 1SMB5932BT3G is a standard SOD-123 package with a pad size of 0.8mm x 0.8mm and a spacing of 0.5mm between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum operating temperature range for the 1SMB5932BT3G is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • Yes, the 1SMB5932BT3G is suitable for high-reliability applications, such as aerospace, automotive, and industrial control systems, due to its high-quality manufacturing process and rigorous testing.
  • To prevent electrostatic discharge (ESD) damage, use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding direct contact with the die. Store the device in an anti-static bag or container when not in use.

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1SMB5932BT3G Overview

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For a full list of alternate parts for 1SMB5932BT3G, check out Findchips.com