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1SMB5934BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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Symbol
1SMB5934BT3G - onsemi - PCB symbol
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PCB Footprints
1SMB5934BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03
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3D Models
1SMB5934BT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03
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1SMB5934BT3G Details

  • Manufacturer Part Number:

    1SMB5934BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    19 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    15.6 mA

1SMB5934BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 1SMB5934BT3G is a standard SOD-123 package with a pad size of 0.8 mm x 0.8 mm and a spacing of 0.5 mm between pads.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation of the 1SMB5934BT3G according to the thermal derating curve provided in the datasheet, and to ensure good thermal conduction to the PCB and heat sink.
  • The maximum allowable voltage transient for the 1SMB5934BT3G is 40 V for a duration of 100 ns, as specified in the datasheet. Exceeding this limit may damage the device.
  • Yes, the 1SMB5934BT3G can be used in switching power supply applications, but it is recommended to ensure that the device is properly bypassed and filtered to prevent high-frequency noise and voltage transients from damaging the device.
  • To prevent ESD damage, it is recommended to handle the 1SMB5934BT3G with ESD-protective equipment, such as wrist straps and mats, and to follow proper ESD handling procedures.

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1SMB5934BT3G Overview

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1SMB5934BT3G Alternates

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For a full list of alternate parts for 1SMB5934BT3G, check out Findchips.com