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1SMB5937B-13 - Diodes Incorporated

Description: Zener Diodes 3.0W SM POWER ZENER 6.2V 39V 200mA 1.2

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1SMB5937B-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
1SMB5937B-13 - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMB
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3D Models
1SMB5937B-13 - Diodes Incorporated - 3D model - Diodes Moulded - SMB
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1SMB5937B-13 Details

  • Manufacturer Part Number:

    1SMB5937B-13

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    33 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Voltage-Nom:

    33 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    11.4 mA

1SMB5937B-13 Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 1SMB5937B-13 can be found in the Diodes Incorporated's package outline drawing, which is usually available on the manufacturer's website or through a request to their technical support team.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a soldering iron with a temperature control and a solder with a melting point compatible with the device's lead finish.
  • The 1SMB5937B-13 has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a heat sink or a thermal pad, and follow the recommended PCB layout and thermal design guidelines to minimize thermal resistance.
  • The 1SMB5937B-13 is a commercial-grade device, but Diodes Incorporated offers other variants with enhanced reliability and automotive-grade options. Check the manufacturer's website or contact their technical support team for more information on available options.
  • Store the 1SMB5937B-13 in its original packaging or an anti-static bag, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the device by the body, not the leads, to prevent damage.

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1SMB5937B-13 Overview

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