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1SMB5947BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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1SMB5947BT3G - onsemi - PCB symbol
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1SMB5947BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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1SMB5947BT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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1SMB5947BT3G Details

  • Manufacturer Part Number:

    1SMB5947BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    160 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    82 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    4.6 mA

1SMB5947BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 1SMB5947BT3G is a standard SOD-323 package with a 1.7mm x 1.3mm pad size, with a 0.5mm x 0.5mm thermal pad in the center.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-55°C to 150°C), and that the PCB is designed to dissipate heat effectively. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • The maximum allowable voltage transient for the 1SMB5947BT3G is 30V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the 1SMB5947BT3G can be used in switching power supply applications, but ensure that the device is operated within its recommended operating conditions and that the PCB is designed to minimize electromagnetic interference (EMI).
  • To prevent electrostatic discharge (ESD) damage, handle the 1SMB5947BT3G with an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Avoid touching the device's pins or leads, and use ESD-safe packaging and storage materials.

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1SMB5947BT3G Overview

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1SMB5947BT3G Alternates

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Part Image 1SMB5947BT3 onsemi

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Part Image HSMBJ5947BE3TR Microsemi Corporation (now Microchip)

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For a full list of alternate parts for 1SMB5947BT3G, check out Findchips.com