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1SS357(F) - Toshiba

Description: Toshiba 45V 100mA, Schottky Diode, 2-Pin SOD-323 1SS357(F)

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PCB Footprints
1SS357(F) - Toshiba PCB footprint - Other - Other - 1SS357(F)-3
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3D Models
1SS357(F) - Toshiba  - 3D model - Other - 1SS357(F)-3
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1SS357(F) Details

  • Manufacturer Part Number:

    1SS357(F)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-G2

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.2 W

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

1SS357(F) Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 1SS357(F) is -40°C to 125°C.
  • The 1SS357(F) should be stored and shipped in a dry, cool place, away from direct sunlight and moisture. It's recommended to use anti-static packaging and handling procedures to prevent damage.
  • The maximum allowable power dissipation for the 1SS357(F) is 500 mW. Exceeding this limit may cause the device to overheat and fail.
  • Yes, the 1SS357(F) is suitable for high-reliability and automotive applications, but it's essential to follow the recommended operating conditions and guidelines to ensure reliable operation.
  • Follow the recommended soldering temperature and time guidelines, and ensure the device is properly mounted on a PCB with adequate thermal dissipation to prevent overheating.

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1SS357(F) Overview

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