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1SS376 - ROHM Semiconductor

Description: 1) Small surface mounting type. (UMD2) 2) VRM=300V guaranteed. 3) High reliability.

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Symbol
1SS376 - ROHM Semiconductor - PCB symbol
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PCB Footprints
1SS376 - ROHM Semiconductor PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-323
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3D Models
1SS376 - ROHM Semiconductor - 3D model - Small Outline Diode Flat Lead - SOD-323
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1SS376 Details

  • Manufacturer Part Number:

    1SS376

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-76

  • Package Description:

    SC-76, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    0.3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Recovery Time-Max:

    0.1 µs

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

1SS376 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 1SS376 is -40°C to 125°C, although it can withstand storage temperatures from -55°C to 150°C.
  • To ensure proper soldering, follow the recommended soldering conditions: peak temperature of 260°C, soldering time of 10 seconds, and use a solder with a melting point above 217°C.
  • The maximum allowable power dissipation for the 1SS376 is 500 mW, and it's essential to ensure the device is properly heat-sinked to prevent overheating.
  • While the 1SS376 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, it's essential to consider the device's parasitic capacitance and inductance when designing the circuit.
  • To prevent ESD damage, handle the 1SS376 with an anti-static wrist strap or mat, and ensure the device is stored in an anti-static package. Additionally, follow proper ESD handling procedures during assembly and testing.

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1SS376 Overview

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