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1SS400_R1_00001 - PANJIT

Description: Diodes - General Purpose, Power, Switching 90Vll Signal Switching Diodes 4A

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PCB Footprints
1SS400_R1_00001 - PANJIT PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-523
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3D Models
1SS400_R1_00001 - PANJIT  - 3D model - Small Outline Diode Flat Lead - SOD-523
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1SS400_R1_00001 Details

  • Manufacturer Part Number:

    1SS400_R1_00001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, ULTRA SMALL, PLASTIC PACKAGE-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    PanJit Semiconductor

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.225 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.2 W

  • Rep Pk Reverse Voltage-Max:

    90 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

1SS400_R1_00001 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the PanJit Semiconductor's application note AN-XXXX, which provides detailed guidelines for optimal performance and thermal management.
  • The 1SS400_R1_00001 has a thermal pad on the bottom, which should be connected to a thermal ground plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • The 1SS400_R1_00001 is rated for operation from -40°C to 125°C, but it's recommended to derate the device's performance and power handling at temperatures above 85°C to ensure reliability and longevity.
  • The 1SS400_R1_00001 is a commercial-grade device, but PanJit Semiconductor offers a variant with enhanced reliability and quality control for high-reliability and automotive applications. Contact PanJit Semiconductor for more information on the automotive-grade version.
  • The recommended soldering profile for the 1SS400_R1_00001 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. A soldering iron with a temperature range of 350-400°C is recommended for hand soldering.

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1SS400_R1_00001 Overview

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