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1SV305,H3F(T - Toshiba

Description: Toshiba 1SV305,H3F(T Varactor Diode, 5.3pF min, 10V, 2-Pin 1-1G1A

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1SV305,H3F(T - Toshiba PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - 1-1G1A
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1SV305,H3F(T - Toshiba  - 3D model - Small Outline Diode Flat Lead - 1-1G1A
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1SV305,H3F(T Details

  • Manufacturer Part Number:

    1SV305,H3F(T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    3

  • Breakdown Voltage-Min:

    10 V

  • Configuration:

    SINGLE

  • Diode Cap Tolerance:

    5.46%

  • Diode Capacitance Ratio-Min:

    2.8

  • Diode Capacitance-Nom:

    18.3 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    VARIABLE CAPACITANCE DIODE

  • Frequency Band:

    VERY HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-F2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Rep Pk Reverse Voltage-Max:

    10 V

  • Reverse Current-Max:

    0.003 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Variable Capacitance Diode Classification:

    ABRUPT

1SV305,H3F(T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance is to keep the input and output traces as short as possible, and to use a solid ground plane to reduce noise and EMI. Additionally, it's recommended to place a 10uF capacitor between the input and ground pins to filter out high-frequency noise.
  • To ensure reliable operation over the full operating temperature range, it's recommended to follow proper thermal design guidelines, such as providing adequate heat sinking and airflow, and to derate the device's power dissipation accordingly. Additionally, it's recommended to use a thermally conductive material, such as a thermal pad or thermal tape, to improve heat transfer between the device and the heat sink.
  • The recommended input capacitor is a 10uF ceramic capacitor with a voltage rating of 50V or higher, and the recommended output capacitor is a 22uF ceramic capacitor with a voltage rating of 50V or higher. These capacitors help to filter out high-frequency noise and improve the device's overall performance and stability.
  • To protect the device from overvoltage and undervoltage conditions, it's recommended to use a voltage regulator or a voltage supervisor circuit to monitor the input voltage and shut down the device if it exceeds the recommended operating range. Additionally, it's recommended to use a TVS (Transient Voltage Suppressor) diode to protect the device from voltage transients and spikes.
  • The recommended soldering temperature for this device is 260°C (500°F) for a maximum of 10 seconds. It's recommended to use a soldering iron with a temperature control and to avoid applying excessive heat or force to the device during the soldering process.

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1SV305,H3F(T Overview

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