1SV305,H3F footprint, schematic symbol and 3D model by Toshiba

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1SV305,H3F Details

The recommended operating temperature range for the 1SV305 is -40°C to 125°C.
To ensure reliability, it is recommended to derate the voltage and current ratings of the 1SV305 at high temperatures, and to use a heat sink or thermal management system to keep the junction temperature below 125°C.
The maximum allowable power dissipation for the 1SV305 is 1.5W, but this can be affected by the ambient temperature and the thermal resistance of the device.
The 1SV305 is a surface-mount device and should be handled with care to avoid damage. It is recommended to use a vacuum pickup tool or a solderless breadboard to handle the device, and to avoid touching the leads or the package to prevent damage from electrostatic discharge.
The recommended soldering temperature profile for the 1SV305 is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/second.

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