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2003-20-SM-RPLF - Bourns

Description: BOURNS - 2003-20-SM-RPLF - Gas Discharge Tube (GDT), 2003 Series, 200 V, SMD, 1 kA, 700 V

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Symbol
2003-20-SM-RPLF - Bourns - PCB symbol
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PCB Footprints
2003-20-SM-RPLF - Bourns PCB footprint - Other - Other - 2003-20-SM-RPLF-7
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3D Models
2003-20-SM-RPLF - Bourns - 3D model - Other - 2003-20-SM-RPLF-7
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2003-20-SM-RPLF Details

  • Manufacturer Part Number:

    2003-20-SM-RPLF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-2

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • JESD-30 Code:

    O-XXSS-N2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XSS

  • Package Shape:

    ROUND

  • Package Style:

    SPECIAL SHAPE

  • Surface Mount:

    NO

  • Telecom IC Type:

    GAS DISCHARGE TUBE SUPPRESSOR

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

2003-20-SM-RPLF Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 2003-20-SM-RPLF is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • To handle the component's sensitivity to moisture, it's recommended to store the 2003-20-SM-RPLF in a dry environment with a relative humidity below 60%. During assembly, ensure that the component is not exposed to moisture or high humidity. If reflow soldering is used, follow the recommended reflow profile to minimize moisture absorption.
  • The maximum operating temperature range for the 2003-20-SM-RPLF is -40°C to +125°C. However, it's recommended to operate the component within the specified temperature range for optimal performance and reliability.
  • Yes, the 2003-20-SM-RPLF is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • The recommended soldering process for the 2003-20-SM-RPLF is reflow soldering with a peak temperature of 260°C ± 5°C. Ensure that the soldering process is performed within the recommended temperature range and time to prevent damage to the component.

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2003-20-SM-RPLF Overview

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