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2011-1X03G00SB - OUPIN

Description: Connector Header Through Hole 3 position 0.100" (2.54mm)

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PCB Footprints
2011-1X03G00SB - OUPIN PCB footprint - Header, Vertical - Header, Vertical - 2011-1X03G00SB
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3D Models
2011-1X03G00SB - OUPIN  - 3D model - Header, Vertical - 2011-1X03G00SB
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2011-1X03G00SB Details

  • Manufacturer Part Number:

    2011-1X03G00SB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Oupiin

  • Body Breadth:

    0.098 inch

  • Body Depth:

    0.098 inch

  • Body Length:

    0.29 inch

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Nickel/Gold (Ni/Au)

  • Contact Gender:

    MALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    20 mΩ

  • Contact Style:

    SQ PIN-SKT

  • Dielectric Withstanding Voltage:

    1000VAC V

  • Filter Feature:

    NO

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    POLYBUTYLENE TEREPHTHALATE

  • JESD-609 Code:

    e4

  • Mating Contact Pitch:

    0.1 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    STRAIGHT

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    1

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    RECTANGULAR

  • Plating Thickness:

    FLASH inch

  • Rated Current (Signal):

    3 A

  • Reference Standard:

    UL

  • Terminal Length:

    0.118 inch

  • Terminal Pitch:

    2.54 mm

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    3

  • UL Flammability Code:

    94V-0

2011-1X03G00SB Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer PCB with a solid ground plane on the bottom layer can help with heat dissipation. Keep the thermal pad connected to the ground plane to reduce thermal resistance.
  • Use a stable clock source, ensure proper signal termination, and implement error checking and correction mechanisms in your firmware. Also, follow the recommended pin connections and signal routing guidelines.
  • The operating temperature range is -40°C to 85°C. However, the module's performance and reliability may degrade if operated consistently at the extreme ends of this range.
  • While the module is designed to be robust, it's still recommended to take precautions in humid or high-vibration environments. Consider using conformal coating, potting, or other environmental protection methods to ensure reliability.
  • Use a logic analyzer or oscilloscope to debug signal issues. Check the power supply, clock, and reset signals. Verify that the module is properly configured and that the firmware is correct. Consult the datasheet and application notes for troubleshooting guides.

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2011-1X03G00SB Overview

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