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210-3MS - CTS

Description: DIP Switches / SIP Switches 3 switch sections SPST

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210-3MS - CTS PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP6
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210-3MS - CTS  - 3D model - Dual-In-Line Packages - DIP6
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210-3MS Details

  • Manufacturer Part Number:

    210-3MS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.90.65

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    CTS Corporation

  • YTEOL:

    7.9

  • Body Breadth:

    6.7 mm

  • Body Height:

    3.8 mm

  • Body Length or Diameter:

    9.09 mm

  • Contact Current(DC)-Max:

    0.1 A

  • Contact (DC) Max Rating R Load:

    .1A@20VDC

  • Contact Voltage(DC)-Max:

    20 V

  • Electrical Life:

    1000 Cycle(s)

  • JESD-609 Code:

    e4

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Switch Sections:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PCB Hole Count:

    6

  • Packing Method:

    ANTI-STATIC TUBE

  • Sealing:

    BOTTOM SEALED

  • Surface Mount:

    NO

  • Switch Action:

    LATCHED

  • Switch Function:

    SPST

  • Switch Type:

    SLIDE DIP SWITCH

  • Terminal Finish:

    Gold (Au)

  • Termination Type:

    SOLDER

210-3MS Frequently Asked Questions (FAQs)

  • A good PCB layout for the 210-3MS involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the input traces to reduce noise and electromagnetic interference (EMI).
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and the VEE pin to a stable voltage sink. The recommended bias voltage is typically between 5V and 15V, but consult the datasheet for specific voltage ranges.
  • The maximum power dissipation of the 210-3MS is typically around 1W. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power for extended periods.
  • To troubleshoot common issues, check the PCB layout for noise and EMI, ensure proper biasing and power supply decoupling, and verify that the input and output impedances are matched. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the 210-3MS is susceptible to EMI/EMC issues due to its high-frequency operation. Ensure proper shielding, use EMI filters, and follow good PCB layout practices to minimize EMI/EMC issues.

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