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2121955010 - Molex

Description: Sentrality 8.00mm Bottom-entry, Height Above Board 5.60mm, Surface Mount Socket Assembly with +/-1.00mm Misalignment Capability, Tape and Reel

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PCB Footprints
2121955010 - Molex PCB footprint - Other - Other - 2121955010
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3D Models
2121955010 - Molex  - 3D model - Other - 2121955010
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2121955010 Details

  • Manufacturer Part Number:

    2121955010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.90.40.00

  • Manufacturer:

    Molex

  • Additional Feature:

    MATERIAL: COPPER ALLOY; FINISH: GOLD

  • Rated Current:

    200 A

  • Rated Voltage:

    600 V

  • Safety Approval:

    UL

  • Terminal and Terminal Block Type:

    PCB TERMINAL

2121955010 Frequently Asked Questions (FAQs)

  • The recommended mating sequence for the 2121955010 connector is to mate the guide pins first, followed by the signal pins. This ensures proper alignment and prevents damage to the connector.
  • Yes, the 2121955010 connector is designed to withstand high-vibration environments. However, it's recommended to follow Molex's guidelines for vibration testing and to ensure proper mounting and strain relief to prevent connector damage.
  • The maximum cable bend radius for the 2121955010 connector is 10mm. Exceeding this radius may cause damage to the cable or connector.
  • The 2121955010 connector is designed for use with specific cable types. Before using it with a different cable type, ensure that the cable meets Molex's specifications and guidelines for compatibility.
  • The operating temperature range for the 2121955010 connector is -40°C to 105°C. Exceeding this range may affect the connector's performance and reliability.

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2121955010 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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