22R223MC - Murata Electronics

22R223MC Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the 22R223MC?
  Murata recommends a land pattern with a pad size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape, and a minimum clearance of 0.2mm between the pad and the solder mask.
• How do I handle the 22R223MC's sensitivity to moisture?
  To prevent moisture-related issues, store the components in a dry environment (less than 30% RH) and follow the recommended baking procedure before reflow soldering. Also, ensure that the PCB is properly cleaned and dried before assembly.
• What is the maximum reflow temperature for the 22R223MC?
  The maximum reflow temperature for the 22R223MC is 260°C, with a maximum dwell time of 30 seconds above 240°C. Exceeding this temperature may cause damage to the component.
• Can I use the 22R223MC in a high-vibration environment?
  While the 22R223MC is designed to be robust, it's still important to consider the vibration environment. Murata recommends following the IEC 60068-2-6 standard for vibration testing, and ensuring that the component is properly secured to the PCB to prevent mechanical stress.
• How do I troubleshoot issues with the 22R223MC's self-resonance frequency?
  To troubleshoot issues with the self-resonance frequency, ensure that the component is properly mounted on the PCB, and that the PCB layout and surrounding components are not affecting the resonant frequency. Also, verify that the component is not damaged or counterfeit.