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24LC16BHT-I/MNY - Microchip

Description: EEPROM 16K 2KX8 2.5V SERIAL EE IND 1/2 ARRAY WP

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24LC16BHT-I/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 24LC16BHT-I/MNY
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24LC16BHT-I/MNY - Microchip  - 3D model - Small Outline No-lead - 24LC16BHT-I/MNY
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24LC16BHT-I/MNY Details

  • Manufacturer Part Number:

    24LC16BHT-I/MNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010MMMR

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Memory Density:

    16384 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2KX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

24LC16BHT-I/MNY Frequently Asked Questions (FAQs)

  • The 24LC16BHT-I/MNY has a minimum of 1 million write cycles, but the actual number of write cycles may vary depending on the application and operating conditions.
  • The 24LC16BHT-I/MNY uses a page write buffer to handle writes. The device can write up to 16 bytes in a single page write operation. For block writes, the device can write up to 128 bytes in a single block write operation. Refer to the datasheet for specific timing and protocol requirements.
  • The recommended voltage range for the 24LC16BHT-I/MNY is 2.5V to 5.5V. Operating the device outside of this range may affect its performance and reliability.
  • The 24LC16BHT-I/MNY requires a specific power-up and power-down sequencing to ensure proper operation. The VCC pin should be powered up before the SCL pin, and the SCL pin should be powered down before the VCC pin. Refer to the datasheet for specific timing requirements.
  • The maximum clock frequency for the 24LC16BHT-I/MNY is 400 kHz. Operating the device at higher clock frequencies may affect its performance and reliability.

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24LC16BHT-I/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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