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24LC32AT-E/MNY - Microchip

Description: EEPROM 32K 4K X 8 2.5V SER EE EXT

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24LC32AT-E/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 24LC32AT-E/MNY
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24LC32AT-E/MNY - Microchip  - 3D model - Small Outline No-lead - 24LC32AT-E/MNY
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24LC32AT-E/MNY Details

  • Manufacturer Part Number:

    24LC32AT-E/MNY

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDDR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Memory Density:

    32768 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

24LC32AT-E/MNY Frequently Asked Questions (FAQs)

  • The 24LC32AT-E/MNY has a minimum of 1 million write cycles, but the actual number of write cycles may vary depending on the application and usage.
  • To ensure data integrity, use the 24LC32AT-E/MNY's built-in power-on reset (POR) and brown-out detection (BOD) features. Additionally, implement a robust power-down sequence in your system design to prevent data corruption.
  • The recommended clock frequency for the 24LC32AT-E/MNY is up to 400 kHz. However, the device can operate at frequencies up to 1 MHz, but with reduced performance and reliability.
  • The 24LC32AT-E/MNY uses a page-write architecture. To perform a page write, send a write command followed by the page address and data. For block writes, use multiple page writes or use the device's internal buffer to store data before writing it to the memory array.
  • The WP (Write Protect) pin is used to prevent accidental writes to the device. When the WP pin is tied low, the device is in write-protect mode, and any write attempts will be ignored.

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24LC32AT-E/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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