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24LC512-I/ST - Microchip

Description: 512K, 64K X 8, 2.5V SER EEPROM, IND

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PCB Footprints
24LC512-I/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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3D Models
24LC512-I/ST - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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24LC512-I/ST Details

  • Manufacturer Part Number:

    24LC512-I/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TSSOP-8

  • Country Of Origin:

    Mainland China, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDDR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Memory Density:

    524288 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    65536 words

  • Number of Words Code:

    64000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64KX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

24LC512-I/ST Frequently Asked Questions (FAQs)

  • The 24LC512-I/ST has a minimum of 1 million write cycles, but this can vary depending on the operating conditions and usage patterns.
  • The 24LC512-I/ST uses a page write buffer to handle writes. The device is organized into 128-byte pages, and writes can be performed in 1-byte increments. For block writes, the device can perform a 128-byte page write in a single operation.
  • The WP (Write Protect) pin is used to prevent writes to the entire device or a specific block of memory. When the WP pin is tied low, the entire device is write-protected. When the WP pin is tied high, the device can be written to normally.
  • The 24LC512-I/ST requires a power-up sequence of VCC > VPP > SCL > SDA, and a power-down sequence of SDA > SCL > VPP > VCC. This ensures that the device is properly initialized and avoids any potential data corruption.
  • The 24LC512-I/ST has a maximum clock frequency of 400 kHz for standard mode and 1 MHz for fast mode.

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24LC512-I/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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