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24LC64F-E/MS - Microchip

Description: EEPROM 64K 8K X 8 2.5V SER EE EXT 1/4AWP

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24LC64F-E/MS - Microchip - PCB symbol
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24LC64F-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - MSOP
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24LC64F-E/MS - Microchip - 3D model - Small Outline Packages - MSOP
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24LC64F-E/MS Details

  • Manufacturer Part Number:

    24LC64F-E/MS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDDR

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

24LC64F-E/MS Frequently Asked Questions (FAQs)

  • The 24LC64F-E/MS has a minimum of 1 million write cycles, but this can vary depending on the operating conditions and usage patterns.
  • The 24LC64F-E/MS uses a page write buffer to handle writes. The device can write up to 32 bytes in a single page write operation. For block writes, the device can write up to 64 bytes in a single block write operation. The datasheet provides more information on the write protocols and timing.
  • The recommended clock frequency for the 24LC64F-E/MS is up to 1 MHz for standard mode and up to 3.4 MHz for fast mode. However, the actual clock frequency may vary depending on the system design and operating conditions.
  • The 24LC64F-E/MS requires a specific power-up and power-down sequencing to ensure proper operation. The datasheet provides guidelines for power-up and power-down sequencing, including the recommended timing and voltage levels.
  • The typical current consumption for the 24LC64F-E/MS is around 1 mA for read and write operations, and around 10 μA for standby mode. However, the actual current consumption may vary depending on the operating conditions and usage patterns.

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24LC64F-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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