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252010CDMCDDS-1R0MC - Sumida

Description: SMD POWER INDUCTOR

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252010CDMCDDS-1R0MC - Sumida PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 252010CDMCDDS-1R0MC
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252010CDMCDDS-1R0MC - Sumida  - 3D model - Inductors Precision Moulded - 252010CDMCDDS-1R0MC
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252010CDMCDDS-1R0MC Details

  • Manufacturer Part Number:

    252010CDMCDDS-1R0MC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Sumida Corporation

  • YTEOL:

    7

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.048 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    4 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

252010CDMCDDS-1R0MC Frequently Asked Questions (FAQs)

  • Sumida Corporation provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure optimal performance, minimize electromagnetic interference, and prevent thermal issues.
  • To ensure reliability and longevity, it's crucial to follow the recommended operating temperature range and derating guidelines. Additionally, consider using thermal management techniques, such as heat sinks or thermal pads, to keep the component within a safe operating temperature range.
  • Store the component in a dry, cool place, away from direct sunlight and moisture. Avoid exposing it to extreme temperatures, humidity, or physical stress. Follow the recommended storage and handling guidelines provided by Sumida Corporation or industry standards to prevent damage or degradation.
  • The 252010CDMCDDS-1R0MC is designed to meet specific vibration and shock requirements. However, it's essential to consult with Sumida Corporation or a qualified engineer to determine if the component can withstand the specific environmental conditions of your application.
  • To minimize electromagnetic interference (EMI) and radio-frequency interference (RFI), follow proper PCB design and layout guidelines, use shielding materials or components, and consider adding EMI filters or chokes to the circuit. Consult with Sumida Corporation or a qualified engineer for specific guidance.

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252010CDMCDDS-1R0MC Overview

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