The recommended PCB footprint for the 25EV1K125.ZXBDM is a rectangular pad with dimensions of 5.08mm x 3.81mm, with a thermal pad of 2.54mm x 2.54mm in the center. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
While the 25EV1K125.ZXBDM is a high-quality component, it's essential to check the specific requirements of your high-reliability or aerospace application. Littelfuse Inc may have specific variants or screening options available for these applications. It's recommended to contact Littelfuse Inc directly to discuss your specific requirements.
To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Use a solder with a melting point of 217°C to 221°C. It's also essential to follow proper PCB design and layout guidelines to prevent thermal stress and ensure reliable operation.
The maximum allowed voltage derating for the 25EV1K125.ZXBDM is 80% of the rated voltage. This means that if the component is rated for 125V, the maximum allowed voltage derating would be 100V. It's essential to follow this guideline to prevent premature failure and ensure reliable operation.
The 25EV1K125.ZXBDM is rated for operation up to 150°C. However, it's essential to consider the derating factors and ensure that the component is not exposed to temperatures above the recommended maximum. It's also important to consider the thermal management of the system to prevent overheating and ensure reliable operation.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
25EV1K125.ZXBDM Overview
Use the download button to access the 25EV1K125.ZXBDM 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 25EV1,
or try a keyword search, such as Electric Fuses
