25LC256-I/STG - Microchip

25LC256-I/STG Details

• Manufacturer Part Number:

  25LC256-I/STG

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  TSSOP

• Package Description:

  4.40 MM, PLASTIC, MO-153, TSSOP-8

• Pin Count:

  8

• Country Of Origin:

  Thailand

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  5

• Clock Frequency-Max (fCLK):

  10 MHz

• Data Retention Time-Min:

  200

• Endurance:

  1000000 Write/Erase Cycles

• JESD-30 Code:

  R-PDSO-G8

• JESD-609 Code:

  e3

• Length:

  4.4 mm

• Memory Density:

  262144 bit

• Memory IC Type:

  EEPROM

• Memory Width:

  8

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  32768 words

• Number of Words Code:

  32000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  32KX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP8,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.1 mm

• Serial Bus Type:

  SPI

• Standby Current-Max:

  0.000001 A

• Supply Current-Max:

  0.005 mA

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  2.5 V

• Supply Voltage-Nom (Vsup):

  4.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  3 mm

• Write Cycle Time-Max (tWC):

  5 ms

• Write Protection:

  HARDWARE/SOFTWARE