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26-60-2070 - Molex

Description: Headers & Wire Housings KK 156 Hdr Assy Tin Hdr Assy Tin 07 Ckt

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PCB Footprints
26-60-2070 - Molex PCB footprint - Header, Vertical - Header, Vertical - 26-60-2070
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3D Models
26-60-2070 - Molex  - 3D model - Header, Vertical - 26-60-2070
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26-60-2070 Details

  • Manufacturer Part Number:

    26-60-2070

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    India, Mexico, Puerto Rico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    8

26-60-2070 Frequently Asked Questions (FAQs)

  • The recommended torque for the screw terminals is 0.5-1.5 Nm (4.4-13.3 in-lbs).
  • Yes, the 26-60-2070 is designed to withstand high-vibration environments, making it suitable for applications such as industrial control systems, automotive, and aerospace.
  • While the datasheet specifies 24-20 AWG wire sizes, the connector can accommodate smaller wire sizes with the use of wire adapters or by consulting with Molex's application engineering team.
  • The 26-60-2070 connector is rated for operation in temperatures ranging from -40°C to 105°C (-40°F to 221°F).
  • Yes, Molex recommends following their PCB layout guidelines to ensure proper connector mating and to prevent damage to the connector or PCB. Consult the Molex application note for specific layout recommendations.

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26-60-2070 Overview

Use the download button to access the 26-60-2070 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 26-60, or try a keyword search, such as Headers and Edge Type Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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