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2DIB1411FXUMA1 - Infineon

Description: Digital Isolators DIGITAL ISOLATORS

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2DIB1411FXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - P-DSO-8
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2DIB1411FXUMA1 - Infineon  - 3D model - Small Outline Packages - P-DSO-8
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2DIB1411FXUMA1 Details

  • Manufacturer Part Number:

    2DIB1411FXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    IT HAS VDD2 SUPPLY VOLTAGE FROM 2.7 TO 5V

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    6.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

2DIB1411FXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2014-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the IGBT's gate-emitter voltage. The driver should also have a suitable propagation delay and rise/fall time to ensure proper switching.
  • The 2DIB1411FXUMA1 has an internal overcurrent protection (OCP) feature that trips at 20A. However, it's recommended to implement an external OCP circuit to ensure reliable protection and prevent damage to the module.
  • Yes, the 2DIB1411FXUMA1 can be used in a parallel configuration, but it's essential to ensure that the modules are matched in terms of electrical characteristics and thermal performance. Infineon provides guidelines for parallel operation in the application note AN2014-03.
  • Infineon recommends using a heat sink with a thermal resistance of ≤ 0.5 K/W and a forced air cooling system with a minimum airflow of 200 L/min. The heat sink should be properly mounted and thermally interfaced with the module.

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