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2ED2101S06FXUMA1 - Infineon

Description: Gate Drivers LEVEL SHIFT SOI

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2ED2101S06FXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 - Lead DSO
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2ED2101S06FXUMA1 - Infineon  - 3D model - Small Outline Packages - 8 - Lead DSO
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2ED2101S06FXUMA1 Details

  • Manufacturer Part Number:

    2ED2101S06FXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.7 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    670 V

  • Supply Voltage1-Min:

    -1 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SOI-CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.11 µs

  • Turn-on Time:

    0.11 µs

  • Width:

    3.9 mm

2ED2101S06FXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
  • The maximum allowed voltage on the gate driver output is 15V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the 2ED2101S06FXUMA1 can be used in a half-bridge configuration. However, ensure proper dead-time management and synchronization between the high-side and low-side switches.
  • Check the input voltage, decoupling capacitors, and PCB layout. Ensure the device is properly powered and the voltage regulator is not overloaded. Consult the datasheet and application notes for more information.

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2ED2101S06FXUMA1 Overview

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