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2ED2109S06FXUMA1 - Infineon

Description: Gate Drivers LEVEL SHIFT SOI

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2ED2109S06FXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 - Lead DSO/
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2ED2109S06FXUMA1 - Infineon  - 3D model - Small Outline Packages - 8 - Lead DSO/
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2ED2109S06FXUMA1 Details

  • Manufacturer Part Number:

    2ED2109S06FXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2019-10-24

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.7 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    10 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SOI-CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.3 µs

  • Turn-on Time:

    1.03 µs

  • Width:

    3.9 mm

2ED2109S06FXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • The selection of a gate driver depends on the specific application requirements, such as voltage, current, and switching frequency. Infineon recommends using their dedicated gate driver ICs, such as the 1EDC or 2EDL, which are designed to work with their IGBT modules.
  • The maximum allowed overcurrent and overvoltage for the 2ED2109S06FXUMA1 are specified in the datasheet, but it's essential to note that exceeding these limits can lead to permanent damage. It's recommended to design the system with sufficient margins to ensure reliable operation.
  • To ensure EMC, follow the guidelines in the datasheet and application notes, and consider using shielding, filtering, and grounding techniques to minimize electromagnetic interference. Additionally, consult the relevant EMC standards, such as IEC 61800-3, for specific requirements.
  • The recommended cooling system depends on the specific application and power dissipation requirements. Infineon provides guidelines for heat sink selection, thermal interface materials, and cooling system design in their application notes and datasheets.

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