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2ED21844S06JXUMA1 - Infineon

Description: INFINEON - 2ED21844S06JXUMA1 - MOSFET DRIVER, -40 TO 125DEG C

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2ED21844S06JXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - DSO - 14
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2ED21844S06JXUMA1 - Infineon  - 3D model - Small Outline Packages - DSO - 14
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2ED21844S06JXUMA1 Details

  • Manufacturer Part Number:

    2ED21844S06JXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Date Of Intro:

    2019-10-24

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    2.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    670 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SOI-CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.3 µs

  • Turn-on Time:

    0.84 µs

  • Width:

    3.9 mm

2ED21844S06JXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
  • Infineon recommends a peak reflow temperature of 260°C, with a maximum time above 217°C of 30 seconds. The device is compatible with lead-free soldering processes.
  • Infineon recommends storing the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads.
  • Infineon recommends following standard ESD precautions, such as using an ESD wrist strap or mat, and handling the devices in a static-protected environment.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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2ED21844S06JXUMA1 Overview

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