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2EDB8259FXUMA1 - Infineon

Description: 5A, 9A Gate Driver Magnetic Coupling 3000Vrms 2 Channel PG-DSO-16

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2EDB8259FXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - DSO16-150mil
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2EDB8259FXUMA1 - Infineon  - 3D model - Small Outline Packages - DSO16-150mil
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2EDB8259FXUMA1 Details

  • Manufacturer Part Number:

    2EDB8259FXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    8.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.046 µs

  • Turn-on Time:

    0.047 µs

  • Width:

    3.9 mm

2EDB8259FXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal management guidelines for the 2EDB8259FXUMA1. It's essential to follow these guidelines to ensure optimal performance, reliability, and to prevent thermal-related issues.
  • When selecting a gate driver for the 2EDB8259FXUMA1, consider factors such as the driver's output current, voltage rating, and propagation delay. Infineon recommends using their EiceDRIVER™ gate driver ICs, which are specifically designed to work with their IGBT modules. The 1EDC60/1EDC20 gate driver family is a suitable option for this module.
  • Paralleling multiple 2EDB8259FXUMA1 modules can be done, but it requires careful consideration of the module's current sharing, thermal management, and gate drive synchronization. Infineon provides guidelines for paralleling IGBT modules in their application notes (e.g., AN2019-03). It's essential to follow these guidelines to ensure reliable operation and to prevent current imbalance, thermal runaway, and other issues.
  • The 2EDB8259FXUMA1 does not have built-in overcurrent protection or fault detection. However, you can implement these features using external components, such as current sensors, comparators, and fault detection ICs. Infineon provides examples of overcurrent protection circuits in their application notes (e.g., AN2017-04). It's essential to design a robust protection scheme to prevent damage to the module and ensure safe operation.
  • The 2EDB8259FXUMA1 is designed to meet the reliability requirements of industrial and automotive applications. Infineon provides reliability data, including FIT rates and MTBF values, in their datasheet and reliability reports. The module's lifespan can be influenced by factors such as operating conditions, thermal management, and quality of the PCB assembly. Following Infineon's guidelines and recommended operating conditions can help ensure a long and reliable lifespan for the module.

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