Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
Infineon provides EMC guidelines in their application note AN2013-02, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference.
According to Infineon's application note AN2013-03, the maximum allowed voltage stress on the device pins is 20% above the recommended operating voltage, but not exceeding the absolute maximum ratings specified in the datasheet.
Infineon recommends following the guidelines in their application note AN2013-04 for soldering and rework, including the use of a soldering iron with a temperature of 350°C or less, and avoiding the use of ultrasonic cleaning.
Infineon recommends storing the device in a dry, cool place, away from direct sunlight and moisture, and handling the device by the body rather than the leads to prevent damage.
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