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2EDF8275FXUMA1 - Infineon

Description: Fast, robust, dual-channel, functional and reinforced isolated MOSFET gate-driver with accurate and stable timing

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2EDF8275FXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-16-11
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2EDF8275FXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-16-11
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2EDF8275FXUMA1 Details

  • Manufacturer Part Number:

    2EDF8275FXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • Moisture Sensitivity Level:

    3

2EDF8275FXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal management guidelines for the 2EDF8275FXUMA1. It's essential to follow these guidelines to ensure optimal performance, reliability, and to prevent thermal-related issues.
  • When selecting a gate driver for the 2EDF8275FXUMA1, consider factors such as the driver's output current, voltage rating, and propagation delay. Infineon recommends using their EiceDRIVER™ gate driver family, which is specifically designed to work with their IGBT modules. The EiceDRIVER™ 1EDC20I12BA and 1EDC20I12FA are suitable options for the 2EDF8275FXUMA1.
  • Paralleling multiple 2EDF8275FXUMA1 modules can be done, but it requires careful consideration of the module's internal layout, thermal management, and gate drive circuitry. Infineon provides guidelines for paralleling IGBT modules in their application note (AN2014-03). It's essential to ensure that the modules are properly synchronized, and the gate drive circuitry is designed to handle the increased current and voltage requirements.
  • To protect the 2EDF8275FXUMA1 from faults, implement a comprehensive protection scheme that includes overvoltage protection (OVP), overcurrent protection (OCP), and short-circuit protection (SCP). Infineon recommends using their PRO-SIL™ SBC (Silicon-Based Component) or other dedicated protection ICs, such as the Infineon EicePROTECT™, to provide robust protection for the IGBT module.
  • The 2EDF8275FXUMA1 is designed to operate in high-temperature and high-stress environments. Infineon provides reliability data and lifetime expectations for their IGBT modules in their datasheets and application notes. The module's lifetime is influenced by factors such as junction temperature, switching frequency, and operating conditions. It's essential to follow Infineon's guidelines and recommendations to ensure the module operates within its specified ratings and to achieve optimal reliability and lifetime.

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